Ball-Attach Flux

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ID
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Lloyd - ISO 9001:2008, ISO/TS 16949:2009, EN ISO 13485:2012, AS 9100 Rev. C / EN 9100:2009, AS 9120 Rev. A / EN 9120:2010, ISO 14001:2005, OHSAS 18001:2007 - SR OHSAS 18001:2008

Lloyd - ISO 9001:2008, ISO/TS 16949:2009, EN ISO 13485:2012, AS 9100 Rev. C / EN 9100:2009, AS 9120 Rev. A / EN 9120:2010, ISO 14001:2005, OHSAS 18001:2007 - SR OHSAS 18001:2008

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Ball-Attach Flux

The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed.

BGA fluxes are usually water soluble, while PGA fluxes are often very reactive no-clean materials.