BF-3Si In-line 3D SPI

• Solder Paste Inspection based on 3D data
• Inspection with a combination of 2D and 3D images

Printed solder paste condition will be measured and automatically judged in 3D for each pad. Since no part is placed at post print process, measurement area with active projection has been optimized based on warpage of sample and printed solder paste thickness. Using broad measurement dynamic range, warpage of sample can be automatically measured. High rigidity gantry, high speed imaging system and CAD data generation also be provided