BF-X2
The three strengths useful in production site
- Automated high-solution 3D measuring technology
Enables to detect the defects by using the high quality image.
- Reliable hardware design
Achieved both machine safety and easy maintenance.
- Worldwide Service
We are offering satisfactory supports all over the world.
Our unique technology “Planar CT” enables to make high-precision 3D data
Saki’s unique “Planar CT Technology” analyzes the internal structures of planar objects. The detector moves parallel with the planar object capturing images from various directions. By using these diagonal images, it calculates the tomographic views of the planar object quickly and accurately. By the unique movement which both the detector and the objects moves parallel, it enables to correct the position reflecting to create high resolution image b less images taken.
The X-Ray inspection system will open the new world of SMT inspection
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Visualize the inner structure to realize zero flow of defects
We now see the road to perfect quality. BF-X2 erases the concern that you cannot see from optical inspection. It provides security by high-resolution images and numerical judgment. We will visualize everything inside of the objects and contribute to “zero defects” production by the automatic measuring system
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Broaden the range of inspection objects
BF-X2 is the 3D X-ray inspection system which can inspect any defect such as BGA, CSP and device embedded PCBs. Our system could be used both for final quality inspection or defect analysis. The X-ray CT scanning enables the high-resolution inspection of all PCB such as solder inspection of BGA and device embedded PCB which is impossible to inspect from its surface. Also, we adopted 160 kV and 225 kV X-ray tubes. By adopting these solutions, BF-X2 can inspect object such as IGBT power module which is attached to thick copper heat radiation fin.
