- In-line machine optimized for PCB assembly line, which combines micro focus closed type X-ray source and high definition flat panel detector.
- BGA ball’s head in pillow defects, which are said to be one of the most difficult inspection items can be detected automatically without fail.
- BF-X3 can perfectly separate top and bottom side of printed circuit board.
- BF-X3 can also measure solder joint structure of assembled QFNs and BGAs as well as lamination state of PoPs with high definition in 3D.
BF-X3 automatically corrects PCB warpage and position misalignment, and creates 3D data for entire sample by connecting partially reconstructed 3D data. By doing so, it supports inspection data generation for microchips, large ICs and connectors without requiring a user to intentionally execute a special operation for FOV size. Various necessary functions such as stabilization method of X-ray intensity and automatic calibration method are properly equipped with the machines to assure automatic inspection capability.