Precision BGA Spheres Optimize Sphere Performance
Indium Corporation's manufactures solder spheres for PBGA, CBGA, TBGA, µBGA, and flip-chip applications. The solder spheres are made using a proprietary manufacturing process that provides consistently high sphericity and accurate diameters.
Indium Corporation can make almost any solder alloy sphere to suit customer needs. Standard alloys include both Pb-free and SnPb eutectic. Standard sphere diameters are commonly packaged in tape & reel and are listed below. We are constantly expanding and adapting our product offering to meet customer needs, so please contact us if you have a unique request.
Experience has shown us that consistent tape peel strength eliminates process start and stops and materials losses. Indium Corporation's manufacturing procedures and quality assurance eliminates these customer concerns.
Solder spheres are available in many alloys including industry standards: