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Lloyd - ISO 9001:2008, ISO/TS 16949:2009, EN ISO 13485:2012, AS 9100 Rev. C / EN 9100:2009, AS 9120 Rev. A / EN 9120:2010, ISO 14001:2005, OHSAS 18001:2007 - SR OHSAS 18001:2008
Lloyd - ISO 9001:2008, ISO/TS 16949:2009, EN ISO 13485:2012, AS 9100 Rev. C / EN 9100:2009, AS 9120 Rev. A / EN 9120:2010, ISO 14001:2005, OHSAS 18001:2007 - SR OHSAS 18001:2008
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BGA Balls

 

Precision BGA Spheres Optimize Sphere Performance

 

Indium Corporation's manufactures solder spheres for PBGA, CBGA, TBGA, µBGA, and flip-chip applications. The solder spheres are made using a proprietary manufacturing process that provides consistently high sphericity and accurate diameters.

 

Indium Corporation can make almost any solder alloy sphere to suit customer needs. Standard alloys include both Pb-free and SnPb eutectic. Standard sphere diameters are commonly packaged in tape & reel and are listed below. We are constantly expanding and adapting our product offering to meet customer needs, so please contact us if you have a unique request. 

 

 

Peel Strength:

Experience has shown us that consistent tape peel strength eliminates process start and stops and materials losses. Indium Corporation's manufacturing procedures and quality assurance eliminates these customer concerns.

 

Alloys:

Solder spheres are available in many alloys including industry standards:

  • Sn63Pb37
  • Sn62Pb36Ag2
  • Pb90Sn10
  • Pb89.5Sn10.5

 

 

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