A typical fault in the interconnection of BGAs is poor wetting of the pads. The application of new solder spheres can restore functional BGAs to full usability. The components are inserted into a special reballing frame. A stencil with holes corresponding to the contact pads of the BGA is placed onto the component and the solder balls poured into the apertures until all spaces are filled. Finally, the controlled and gentle reflow process in the MINIOVEN 04 completes the procedure.
MARTIN offer a very large selection of stencils for different BGAs, CSPs, etc. from stock. It is also often possible to adapt standard stencils by the use of Kapton tape.
Standard sizes of the frames and stencils cover components from 18x18mm to 52x52mm. For smaller CSPs specifically designed tools can be made available.