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Lloyd - ISO 9001:2008, ISO/TS 16949:2009, EN ISO 13485:2012, AS 9100 Rev. C / EN 9100:2009, AS 9120 Rev. A / EN 9120:2010, ISO 14001:2005, OHSAS 18001:2007 - SR OHSAS 18001:2008
Lloyd - ISO 9001:2008, ISO/TS 16949:2009, EN ISO 13485:2012, AS 9100 Rev. C / EN 9100:2009, AS 9120 Rev. A / EN 9120:2010, ISO 14001:2005, OHSAS 18001:2007 - SR OHSAS 18001:2008
home / Soldering Solution / Flux and Epoxy / Epoxy Flux

Epoxy Flux

 

Epoxy fluxes are often used in no-clean SMT component attach applications.

 

The solder bumps on wafer level CSP, micro BGA or BGA packages are dipped in epoxy fluxes, or the flux is applied to the substrate via a jetting process.

The assembly is then reflowed, and the epoxy flux acts to both clean up the solder joints before reflow, and to reinforce the final joint from the cured polymer.

 

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