Flux and Epoxy
Wave flux
Indium Corporation offers a full line of competitive, state-of-the-art wave solder fluxes for electronics...
Tacky Flux
Indium Corporation manufactures a complete line of TACFlux® which includes no-clean, water-wash, and RMA-based...
Ball-Attach Flux
The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping...
Epoxy Flux
Epoxy fluxes are often used in no-clean SMT component attach applications.
The solder bumps on wafer...
Flip-Chip Flux
The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting...
Flux Pens
Indium Corporation's flux pens utilize a spring-loaded applicator tip to deliver a controlled amount of flux to...
Flux-Coated Preforms
Introduction
Flux-Coated Preforms eliminate the costly production step of separate fluxing and increase...
Flux-Cored Wire
Indium Corporation is quickly becoming known as one of the highest quality, full line suppliers of flux-cored...
Industrial Flux
Indium Corporation offers a broad line of specialty materials and fluxes for soldering stainless steel, copper...
Liquid Tabbing Flux
Bringing decades of soldering expertise to the PV industry.
No-Clean, Clear Residue
Non-Conductive
Wider...
Package-on-Package Flux
Package-on-Package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and...
TCB and Copper Pillar Flux
Cu-Pillar Flip-Chip Flux is a dipping flux designed for use in thermocompression bonding flip-chip copper pillar...
Wafer Bumping Flux
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns,...