Flux and Epoxy

Indium Corporation offers a full line of competitive, state-of-the-art wave solder fluxes for electronics...

Indium Corporation manufactures a complete line of TACFlux® which includes no-clean, water-wash, and RMA-based...

The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping...

Epoxy fluxes are often used in no-clean SMT component attach applications. The solder bumps on wafer...

The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting...

Indium Corporation's flux pens utilize a spring-loaded applicator tip to deliver a controlled amount of flux to...

Introduction Flux-Coated Preforms eliminate the costly production step of separate fluxing and increase...

Indium Corporation is quickly becoming known as one of the highest quality, full line suppliers of flux-cored...

Indium Corporation offers a broad line of specialty materials and fluxes for soldering stainless steel, copper...

Bringing decades of soldering expertise to the PV industry. No-Clean, Clear Residue Non-Conductive Wider...

Package-on-Package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and...

Cu-Pillar Flip-Chip Flux is a dipping flux designed for use in thermocompression bonding flip-chip copper pillar...

Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns,...