• Flux and Epoxy
    • Wave flux
    • Tacky Flux
    • Ball-Attach Flux
    • Epoxy Flux
    • Flip-Chip Flux
    • Flux Pens
    • Flux-Coated Preforms
    • Flux-Cored Wire
    • Industrial Flux
    • Liquid Tabbing Flux
    • Package-on-Package Flux
    • TCB and Copper Pillar Flux
    • Wafer Bumping Flux
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Lloyd - ISO 9001:2015, IATF 16949:2016, EN ISO 13485:2016, AS 9100 Rev. D, AS 9120 Rev. B, ISO 14001:2015, ISO 45001:2018
Lloyd - ISO 9001:2015, IATF 16949:2016, EN ISO 13485:2016, AS 9100 Rev. D, AS 9120 Rev. B, ISO 14001:2015, ISO 45001:2018
home / Soldering Solution / Flux and Epoxy

Flux and Epoxy

Wave flux

  Indium Corporation offers a full line of competitive, state-of-the-art wave solder fluxes for electronics...
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Tacky Flux

  Indium Corporation manufactures a complete line of TACFlux® which includes no-clean, water-wash, and RMA-based...
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Ball-Attach Flux

  The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping...
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Epoxy Flux

  Epoxy fluxes are often used in no-clean SMT component attach applications.   The solder bumps on wafer...
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Flip-Chip Flux

  The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting...
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Flux Pens

  Indium Corporation's flux pens utilize a spring-loaded applicator tip to deliver a controlled amount of flux to...
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Flux-Coated Preforms

  Introduction Flux-Coated Preforms eliminate the costly production step of separate fluxing and increase...
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Flux-Cored Wire

  Indium Corporation is quickly becoming known as one of the highest quality, full line suppliers of flux-cored...
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Industrial Flux

  Indium Corporation offers a broad line of specialty materials and fluxes for soldering stainless steel, copper...
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Liquid Tabbing Flux

  Bringing decades of soldering expertise to the PV industry. No-Clean, Clear Residue Non-Conductive Wider...
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Package-on-Package Flux

  Package-on-Package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and...
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TCB and Copper Pillar Flux

  Cu-Pillar Flip-Chip Flux is a dipping flux designed for use in thermocompression bonding flip-chip copper pillar...
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Wafer Bumping Flux

  Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns,...
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