• For Manual Cleaning
  • Ems
    solutions
  • ID
    solutions
  • 3D
    solutions
Lloyd - ISO 9001:2008, ISO/TS 16949:2009, EN ISO 13485:2012, AS 9100 Rev. C / EN 9100:2009, AS 9120 Rev. A / EN 9120:2010, ISO 14001:2005, OHSAS 18001:2007 - SR OHSAS 18001:2008
Lloyd - ISO 9001:2008, ISO/TS 16949:2009, EN ISO 13485:2012, AS 9100 Rev. C / EN 9100:2009, AS 9120 Rev. A / EN 9120:2010, ISO 14001:2005, OHSAS 18001:2007 - SR OHSAS 18001:2008
home / Cleaning Solution / Maintenance Cleaning / For Manual Cleaning

For Manual Cleaning

 

 

VIGON® RC 101

 

Water-based cleaning medium for reflow and wave solder equipment

 

Based on the MPC® Technology, VIGON® RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes re-condensated fluxes and emissions from assemblies.

 

Advantages compared to other oven cleaners:

  • Has no flash point and therefore can be applied directly onto cold or warm surfaces (30 - 40 °C / 86 - 104 °F)
  • The medium does not contain any ingredients, which could leave residues on the oven surfaces. This avoids harmful condensations on the assembly surfaces after restarts
  • Due to the short soaking time, a quick and efficient cleaning process can be achieved and long machine downtimes can be avoided
 

VIGON® RC 303

 

Water-based cleaning medium for reflow ovens and wave solder equipment​

 

VIGON® RC 303 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes re-condensed fluxes and emissions from assemblies.

As the successor to VIGON® RC 101, VIGON® RC 303 delivers an improved cleaning performance with the same high level of operator safety.

 

Advantages compared to other oven cleaners:​

  • Improved cleaning performance
  • Mild formulation
    • No flash point
    • High operator safety
    • Environmentally friendly
    • No special labeling is required
    • Little odor
  • The medium does not contain any ingredients which could leave residues on the oven surfaces. This avoids harmful condensation on the assembly surfaces after restarts.
  • Excellent material compatibility with aluminum and epoxy surfaces  
 

ZESTRON® HC

 

Precision cleaning medium for SMT adhesive removal

 

ZESTRON® HC is a modified alcohol-based cleaning agent designed to remove SMT adhesives from tools such as dispensing nozzles. 
ZESTRON® HC can also be used for the removal of solder particles and dust from pick & place nozzles. It is supplied in an aerosol can for easy manual application.

 

Advantages compared to other cleaners:​

  • Reliably removes SMT adhesives from dispensing nozzles and tools
  • Dries fast and residue-free
  • Does not contain any halogenated compounds
  • The removable dispenser also allows easy cleaning of dispensing nozzles
  • Also applicable for the removal of solder particles and dust from pick & place nozzles
 
Home / LTHD Corporation / News /
© 2013 LTHD Corporation Romania, All rights reserved.