• Gold-Based Solder Paste
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Lloyd - ISO 9001:2015, IATF 16949:2016, EN ISO 13485:2016, AS 9100 Rev. D, AS 9120 Rev. B, ISO 14001:2015, ISO 45001:2018
Lloyd - ISO 9001:2015, IATF 16949:2016, EN ISO 13485:2016, AS 9100 Rev. D, AS 9120 Rev. B, ISO 14001:2015, ISO 45001:2018
home / Soldering Solution / Solder paste and powders / Gold-Based Solder Paste

Gold-Based Solder Paste

 

Gold-tin solder paste is used in a variety of high-reliability applications, where its high melting point, non-creep, high-tensile stress, thermal and electrical conductivity, as well as proven usage life makes it a standard "known-good" material.

 

Advantages

  • Highest tensile strength of any solder
  • High melting point is compatible with subsequent reflow processes
  • Pb-free
  • Superior thermal conductivity
  • Resistance to corrosion
  • Superior thermal fatigue resistance
  • Good joint strength
  • Excellent wetting properties
  • Resistance to oxidation
  • AuSn is compatible with precious metals
  • AuSn is RoHS compliant

Gold-tin Solder Paste

  • 80Au/20Sn Powder
    - Type 3 (25-45 microns)
    - Type 4 (15-38 microns)
    - Type 5 (15-25 microns)
    - Type 6 (10-20 microns)
  • No-clean flux
    - NC-SMQ51SC (used in high-power LED and MEMS)
    - RMA-SMQ51A (for difficult to solder surfaces in die-attach)
    - NC-SMQ75 (halogen-free and low-residue; requires <10ppm oxygen)
  • Low-volume packaging
    - Jars (10g per jar)
    - Syringes (5cc syringes)

Factors to consider

  • Higher yields and cost per unit make gold a viable option, even though the initial cost is higher than alternative solders
  • A low oxygen atmosphere may be required if the application is flux free
  • Some applications require pressure to promote good, void-free reflow on horizontal surfaces.
  • In step soldering or processes that may require rework, soldering to gold plated surfaces results in an intermetallic that melts at a higher temperature than the original alloy. When using the AuSn alloy, this can be addressed by using high tin-containing alloys.
  • Alternative methods, such as scrubbing, forming gas or formic acid, may be needed for oxide removal of the soldered surface.

Processing Options

  • Vacuum soldering: flux-less and void-free soldering
  • Die-attach: high process temperature
  • Reflow: convection, infrared, and induction
  • Laser soldering: targeted soldering
  • Vapor phase reflow: uniform heating
  • Manual Soldering: solder iron, hot plate, ultra sonic, and dipping
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