Heat-Spring®

Many applications call for a TIM (thermal interface material) that can easily be placed on a chip, on a lid, or, perhaps, just against a heat source and a cooling solution contact plate. We developed a metal TIM which works as a compressible Interface Solution for such an application. Our pressure range is 35 psi to 100+ psi.

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An SMA-TIM (soft metal alloy) made of indium offers uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of indium minimizes surface resistance and increases heat flow (conductance). Our patented Heat-Spring®^® technology further reduces the thermal resistance and enhances cooling.

Indium's high-end thermal interface materials deliver superior performance over time. Because SMA-TIM products are made of metal, they cannot experience pump out problems - even under power cycling. Our Heat-Spring®^® material, which does not contain silicone, conforms to surface disparities, reducing thermal resistance through the life of the TIM. Due to its solid state, the SMA-TIM also does not bake out.