Indium Corporation manufactures a wide variety of alloys that range from high temperature Au-based solders to low temperature indium- and bismuth-based solders.
High temperature solders include gold (Au), gold-tin (AuSn), gold-silicon (AuSi), and gold-germanium (AuGe). Alloys that melt at over 270°C are considered brazing alloys.
Gold-based alloys are used in high reliability applications, such as hermetic sealing, aerospace, and medical. These alloys have a high tensile strength, superior thermal fatigue resistance, exceptional thermal conductivity, as well as resistance to corrosion and oxidation.
Low temperature solders include indium- and bismuth-containing alloys such as bismuth-tin (BiSn). They are available as solder preforms, solder paste, solder wire, ingot, or solder ribbon. Applications for low temperature alloys include:
The versatility of indium extends to many forms. Indium Corporation has developed the processes necessary to optimize the manufacturability of indium and its alloys into all of these forms:
- soldering temperature sensitive components
- step soldering
- soldering LEDs
Indium-containing alloys can be used for cryogenic applications, TCE mismatch, and applications that need improved thermal fatigue performance.
Indium Corporation also manufactures solders that are liquid at room temperature. Also referred to as liquid metal, these gallium-containing solders can melt at temperatures as low as 7°C. Liquid metals are available in a syringe or bottle.