Several very low melting point Indalloy® alloys are liquid at room temperature. These gallium-based alloys are finding increased use in various applications as a replacement for toxic mercury, which has a high vapor pressure at room temperature. These alloys have reduced toxicity and lower vapor pressure than mercury.
Excellent Thermal and Electrical Conductivity
Fluxes that have high solids content, as well as higher amounts of halogen, tend to be more heat-stable and solder better with a variety of board types, sizes, and thicknesses.
Gallium and the gallium alloys, like indium, have the ability to wet to many non-metallic surfaces such as glass and quartz. Gently rubbing the gallium alloy into the surface may help induce wetting.
Note: These alloys form a thin dull looking oxide skin that is easily dispersed with mild agitation. The oxide-free surfaces are bright and lustrous.
Typical applications for these materials include thermostats, switches, barometers, heat transfer systems, and thermal cooling and heating designs. Uniquely, they can be used to conduct heat and/or electricity between non-metallic and metallic surfaces.
Alloys are packaged in polyethylene bottles and shipped in accordance with applicable federal regulations.
Unopened bottles have a guaranteed one year shelf life. It is recommended that, as the alloy is removed from the bottle, the volume be replaced with dry argon. This will minimize the possibility of oxidation at the surface of the alloy. If the alloy has been stored below its melting point and has solidified, it should be re-melted and thoroughly shaken or mixed before use. Care should be taken in reheating the alloy in the original packaging provided. Temperatures should not exceed 65.6°C.
Achieving Uniform Solder Bondline Thickness
InFORMS® are reinforced solder preforms that help maintain the required bondline and promote good solder wetting. During the soldering process, the copper does not melt, ensuring that the bondline is maintained across the entire solder joint.
This results in:
- Improved mechanical and thermal reliability
- Uniform bondline thickness
- Low-voiding performance
In testing, InFORMS® have shown to improve the reliability of the interconnect to at least 3500 thermal cycles, which exceeds the typical reliability specification of 1500 passive thermal cycles for -55/+150 °C.
InFORMS® offer dramatically improved handling when compared to conventional solder alloys or indium-based sheets, foils, ribbons, or large preform materials. InFORMS®® also offer increased tensile and compressive strength via the substrate materials, while retaining the unique attributes of the outer layer metal (e.g., the softness, ductility, and other advantages of indium).
InFORMS® provide engineers with an enhanced material for the development of new, or the improvement of existing, applications. They can be used in cryogenic or vacuum seals, EMI and RFI shielding, ground straps, stand-offs, thermal mismatch devices, or backplane assembly washers. While a number of metals may be used, indium metal should be considered for many applications because of its unique attributes. For example, indium readily wets glass, quartz, and glazed ceramics. When compared to conventional solders, indium-based solders significantly reduce scavenging and leaching of gold and other precious metals.
Save time and money with InFORMS® – an innovative solution that maintains uniform solder bondline thickness.
- Reduce voiding
- Improve reliability
- Enhance soldering performance
- Eliminates the need for manual fluxing
- Eliminates excessive flux residue
- Increases productivity
- Applies flux precisely where it is needed
- Applies a uniform amount every time
Flux-Coated Preforms eliminate the costly production step of separate fluxing and increase throughput yields. Flux Coatings for Preforms are available in no-clean and rosin-based chemistries with a variety of activity levels to suit your substrate metallizations.
Indium Corporation’s unique coating process can control the amount of flux to tight tolerances. Flux Coatings are measured and applied by weight percentage. The coatings range from 1-3% and standard tolerances are controlled at +/- .5%. Coatings can be applied to most sizes and shapes of preforms.
The use of Indalloy® flux-coated preforms can result in the following advantages:
- All fluxes used to coat preforms, when reflowed using a standard Sn63 profile, pass SIR tests.
- The precise amount of flux and alloy are delivered to the solder joint.
- The costly production step of separate fluxing is eliminated.
- Bonding is faster because the flux is positioned where it is required, next to the surfaces to be joined, unlike the case with flux-filled preforms.
- Because less flux is used, post solder cleaning is easier.
- The flux quantity is uniform in thickness and consistent in amount from piece to piece.
- The dull, flux-coated surface is ideal for IR reflow.
- Since the flux on flux-coated preforms contains no solvent, voiding is typically less than when manually applying liquid flux to uncoated preforms.
Since the post solder residues of types R and RMA fluxes are considered non-corrosive, non-conductive and non-hydroscopic, flux removal is not usually necessary. If cleaning is desired this is best accomplished with a commercially available flux residue remover.
Best practice is to always remove RA residues in electronics applications.
These liquid soldering fluxes are packaged in 2 different size plastic containers:
- 1 U.S. pint (0.473 liter)
- 1 U.S. gallon (3.785 liter)