• SMT Vacuum Soldering Plus N2
  • Ems
    solutions
  • ID
    solutions
  • 3D
    solutions
Lloyd - ISO 9001:2008, ISO/TS 16949:2009, EN ISO 13485:2012, AS 9100 Rev. C / EN 9100:2009, AS 9120 Rev. A / EN 9120:2010, ISO 14001:2005, OHSAS 18001:2007 - SR OHSAS 18001:2008
Lloyd - ISO 9001:2008, ISO/TS 16949:2009, EN ISO 13485:2012, AS 9100 Rev. C / EN 9100:2009, AS 9120 Rev. A / EN 9120:2010, ISO 14001:2005, OHSAS 18001:2007 - SR OHSAS 18001:2008
home / Thermal Systems / SMT Vacuum Soldering Plus N2

SMT Vacuum Soldering Plus N2

 

”Vacuum Plus”is the new system to improve solder joints. Voids are eliminated in a vacuum chamber, which significantly improves the quality of the soldered products. 

 

The Vacuum PLUS module can be integrated into a new SMT reflow soldering system and retrofitted into existing machines without much downtime and efforts. It can be activated when required and provides maximum flexibility. 

 

Advantages of the SMT Vacuum PLUS

  • Inclusions/voids will be reduced up to 99%
  • Cycle time between 60 to 90 seconds
  • Vacuum process can be switched on/off
  • Nitrogen and Air soldering possible
  • PCB Dimensions: Width 510 mm, Length 320 mm
  • Pass through height: 30 mm (top and bottom)
  • Carriers can be utilized for all sizes of boards
  • Double-sided PCB possible
  • All Vacuum Plus settings are fully computer controlled
  • Only one sealing surface in the vacuum chamber
  • Small footprint ·
  • No increase in nitrogen consumption
  • Only 1.5 kW/h in additional energy consumption
  • Modular, retrofittable system

 

 

Home / LTHD Corporation / News /
© 2013 LTHD Corporation Romania, All rights reserved.