• Solder Paste and Powders
    • Gold-Based Solder Paste
    • Tin-Lead
    • BiAgX
    • SACm
    • Package-on-Package Paste
    • Low / High Temperature
    • Die-Attach
    • Wafer Bumping Paste
    • Solder Fortification
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Lloyd - ISO 9001:2015, IATF 16949:2016, EN ISO 13485:2016, AS 9100 Rev. D, AS 9120 Rev. B, ISO 14001:2015, ISO 45001:2018
Lloyd - ISO 9001:2015, IATF 16949:2016, EN ISO 13485:2016, AS 9100 Rev. D, AS 9120 Rev. B, ISO 14001:2015, ISO 45001:2018
home / Soldering Solution / Solder paste and powders

Solder paste and powders

Gold-Based Solder Paste

  Gold-tin solder paste is used in a variety of high-reliability applications, where its high melting point,...
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Tin-Lead

  As a leader in soldering technology, Indium Corporation offers a number of solder pastes for SnPb circuit board...
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BiAgX

  BiAgX®   The Power Semiconductor market has seen a lot of change in the past 10 years....
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SACm

  SACm™ Soldering Alloy   Easily substituted into existing Pb-free processes Comparable...
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Package-on-Package Paste

  Package-on-package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and...
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Low / High Temperature

  Indium Corporation manufactures a wide variety of alloys that range from high temperature Au-based solders to low...
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Die-Attach

  Die-attach is the term reserved for processes where the face of a die is attached to a substrate by a single joint....
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Wafer Bumping Paste

  Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than...
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Solder Fortification

  Obtaining the correct amount of solder to ensure a strong solder joint is critical in electronics manufacturing....
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