Solder paste and powders
Gold-Based Solder Paste
Gold-tin solder paste is used in a variety of high-reliability applications, where its high melting point,...
Tin-Lead
As a leader in soldering technology, Indium Corporation offers a number of solder pastes for SnPb circuit board...
BiAgX
BiAgX®
The Power Semiconductor market has seen a lot of change in the past 10 years....
SACm
SACm™ Soldering Alloy
Easily substituted into existing Pb-free processes
Comparable...
Package-on-Package Paste
Package-on-package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and...
Low / High Temperature
Indium Corporation manufactures a wide variety of alloys that range from high temperature Au-based solders to low...
Die-Attach
Die-attach is the term reserved for processes where the face of a die is attached to a substrate by a single joint....
Wafer Bumping Paste
Solder bumps on wafers may be produced by a variety of processes.
For bumps with a pitch greater than...
Solder Fortification
Obtaining the correct amount of solder to ensure a strong solder joint is critical in electronics manufacturing....