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Lloyd - ISO 9001:2015, IATF 16949:2016, EN ISO 13485:2016, AS 9100 Rev. D, AS 9120 Rev. B, ISO 14001:2015, ISO 45001:2018
Lloyd - ISO 9001:2015, IATF 16949:2016, EN ISO 13485:2016, AS 9100 Rev. D, AS 9120 Rev. B, ISO 14001:2015, ISO 45001:2018
home / Soldering Solution / Thermal Interface Materials / Solder TIM

Solder TIM

 

Introduction

Solder Thermal Interface Materials radically improve:

  • Heat dissipation efficiency in electronic devices
  • Thermal conductance for high power devices – with densities in excess of 1000 watts
  • End-of-life performance at the thermal interface – to avoid failures common with fluidic solutions such as greases
  • Portable device battery performance – by reducing thermal resistance and cooling fan size
  • Portable device use profile – by reducing heatsink size and mass
  • Compliance with RoHS while accommodating step soldering requirements

Applications

  • Semiconductor Integrated Circuits
  • Power QFNs
  • Power device to PCB attach (TO220, etc.)
  • Telecom
  • Die Attach (Photonics, MOSFETS, etc.)
  • LED attach

 

 

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