Solder TIM
Introduction
Solder Thermal Interface Materials radically improve:
- Heat dissipation efficiency in electronic devices
- Thermal conductance for high power devices – with densities in excess of 1000 watts
- End-of-life performance at the thermal interface – to avoid failures common with fluidic solutions such as greases
- Portable device battery performance – by reducing thermal resistance and cooling fan size
- Portable device use profile – by reducing heatsink size and mass
- Compliance with RoHS while accommodating step soldering requirements
Applications
- Semiconductor Integrated Circuits
- Power QFNs
- Power device to PCB attach (TO220, etc.)
- Telecom
- Die Attach (Photonics, MOSFETS, etc.)
- LED attach