Solder TIM

Introduction

Solder Thermal Interface Materials radically improve:

• Heat dissipation efficiency in electronic devices
• Thermal conductance for high power devices – with densities in excess of 1000 watts
• End-of-life performance at the thermal interface – to avoid failures common with fluidic solutions such as greases
• Portable device battery performance – by reducing thermal resistance and cooling fan size
• Portable device use profile – by reducing heatsink size and mass
• Compliance with RoHS while accommodating step soldering requirements

Applications

• Semiconductor Integrated Circuits
• Power QFNs
• Power device to PCB attach (TO220, etc.)
• Telecom
• Die Attach (Photonics, MOSFETS, etc.)
• LED attach