• Thermal Interface Materials
    • Heat-Spring®
    • NanoFoil®
    • Preforms
    • Ribbon and Foil
    • Other Thermal Interface Materials
    • Solder TIM
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Lloyd - ISO 9001:2015, IATF 16949:2016, EN ISO 13485:2016, AS 9100 Rev. D, AS 9120 Rev. B, ISO 14001:2015, ISO 45001:2018
Lloyd - ISO 9001:2015, IATF 16949:2016, EN ISO 13485:2016, AS 9100 Rev. D, AS 9120 Rev. B, ISO 14001:2015, ISO 45001:2018
home / Soldering Solution / Thermal Interface Materials

Thermal Interface Materials

Heat-Spring®

  Many applications call for a TIM (thermal interface material) that can easily be placed on a chip, on a lid, or,...
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NanoFoil®

Indium Corporation manufactures NanoFoil®, a nanotechnology material that delivers energy in a controlled and precise...
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Preforms

  Solder Preforms are used in a variety of applications that require precise amounts of solder. Preforms come...
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Ribbon and Foil

  High quality Solder Ribbon and Foil manufactured by Indium Corporation is available in many standard alloys and...
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Other Thermal Interface Materials

  Liquid Metal   Introduction Several very low melting point Indalloy® alloys are liquid at...
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Solder TIM

  Introduction Solder Thermal Interface Materials radically improve: Heat dissipation efficiency in...
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