Water Based
Cleaning medium for defluxing with a mild formulation
VIGON® A 250 is a water-based MPC® cleaning agent designed to remove flux residues and solder pastes from electronic assemblies and Power LEDs. Due to its mild formulation, VIGON® A 250 is especially suitable for longer exposure times.
Advantages compared to other cleaners:
- Due to its mild formulation, VIGON® A 250 is especially suitable for longer exposure times
- Surfactant-free formulation prevents the formation of white residues on cleaned parts and cleaning equipment
- Optimal flux removal after die attach increases wire bonding quality as well as light conversion and life time of Power LEDs
- Due to its excellent filterability VIGON® A 250 features an extended bath life
- Has no flash point and does not require an explosion-proof environment
- Does not foam in spray applications and has a low odor
Water-based cleaning medium for flux removal
VIGON® US is a water-based medium specifically developed for the use in ultrasonic, spray-under-immersion and centrifugal cleaning equipment. Based on MPC® Technology, VIGON® US removes all types of flux residues from electronic assemblies, Flip Chip Packages and CMOS.
Advantages compared to other cleaners:
- Easily removes flux residues and solder pastes
- Has no flash point and does not require explosion proof equipment
- Specifically designed for the use in dip tank systems
- Due to its formulation, VIGON® US can be easily rinsed without leaving residues on the surface and provides low ionic contamination of cleaned parts
- Its high bath loading capacity ensures an extended bath life
- Works exceptionally well for the cleaning in capillary spaces and is also suitable for cleaning under low standoff components
- Ensures a void-free underfill by removing all tacky fluxes from Flip Chips/CMOS
- Improves the image resolution/reduces pixel defects due to particle removal from CMOS image sensors
- Low odor
Water-based defluxing agent for spray-in-air cleaning processes
VIGON® A 201 provides excellent cleaning performance in spray-in-air cleaning processes for the cleaning of capillary spaces, e.g. under low standoff components. It leads to shiny solder joints after cleaning without the need for any additives. Additionally, it is recommended for flux removal from Flip Chips, CMOS and Power LEDs.
Advantages compared to other cleaners:
- Successfully cleans under low standoff components
- Especially effective for lead-free No-Clean solder pastes
- High bath loading capacity ensures extended bath life, low maintenance costs and reduced costs per cleaned part
- Easy to rinse and does not leave any residues on the surfaces
- Ensures a void-free underfill and improves the image resolution by removing all tacky fluxes from Flip Chips/CMOS
- Optimal flux removal after die attach increases wire bonding quality as well as light conversion and life time of Power LEDs
Water-based cleaning medium for flux removal
VIGON® A 200 is a water-based cleaning medium specifically developed for the use in high and medium pressure spray equipment such as inline or batch equipment. Based on MPC® Technology, VIGON® A 200 removes all types of flux residues from electronic assemblies, ceramic hybrids, power modules and lead frames. VIGON® A 200 meets the highest cleanliness requirements for subsequent wire bonding and coating steps.
Advantages compared to other cleaners:
- Can easily be filtered and therefore provides an extended bath life and reduces cleaning agent costs
- Can be easily rinsed and does not leave any residues on the surface
- Has no flash point and thus can be applied in all spray-in-air equipment without explosion proof
- Ensures highest cleanliness levels for subsequent wire bonding and coating steps
- Does not contain any halogenated compounds
- Does not foam, even in high pressure applications
- Low odor
Water-based, pH-neutral defluxing agent
VIGON® N 600 is an innovative defluxing product with a revolutionary pH-neutral formulation. Its excellent cleaning performance and ability to remove a wide range of flux residues under pH-neutral conditions is unprecedented. Due to its neutral pH-value, the cleaning agent also demonstrates a high level of material compatibility with sensitive metals and polymers.
Advantages compared to other cleaners:
- Due to its neutral pH-value, VIGON® N 600 demonstrates an unprecedented level of material compatibility on sensitive materials such as aluminum, brass or nickel, plastics, labels and inks
- Performs well at low application concentrations in specific processes
- Good results underneath low standoff components
- Increased wire bonding/molding quality for power modules, leadframe-based discrete components and Power LEDs
- Due to the neutrality of the cleaning agent, the permission for sewage disposal is easier to obtain
Aqueous-based alkaline defluxing agent
ATRON ® AC 205 is specifically designed to remove flux residues in high pressure inline cleaning systems where short contact times are required. When compared to conventional surfactant-based cleaning agents,
ATRON ® AC 205 allows for much shorter contact times and provides a higher bath loading capacity.
Advantages compared to other surfactant cleaners:
- Free of Ethanolamine and other harmful substances
- Allows for a quicker removal of a wide variety of the latest lead-free and eutectic flux residues
- Longer bath life than conventional surfactant-based cleaners
- Gentle formula leaves solder joints and pads shiny and bright
- Ensures a void-free underfill and improves the image resolution by removing all tacky fluxes from Flip Chips/CMOS
- Optimal flux removal after die attach increases wire bonding quality as well as light conversion and life time of Power LEDs
- Extremely low VOC value
Medium for defluxing applications in spray-in-air processes
ATRON® AC 207 is specifically designed to operate at low concentration levels. The product was developed to improve the cleaning performance and bath life of traditional surfactant-based cleaners and is particularly gentle on sensitive metals. ATRON® AC 207 can be used in processes with high as well as medium pressure in inline and batch cleaning systems.
Advantages compared to other surfactant cleaners:
- Due to its mild formulation and the low operating concentration, the cleaning agent demonstrates a superior level of material compatibility with sensitive metals such as aluminum, brass, nickel, etc.
- Excellent cleaning performance, even at low concentrations and temperatures
- Allows for a quicker removal of a wide variety of the latest lead-free and eutectic flux residues
- Ensures a void-free underfill by removing all tacky fluxes from Flip Chips
- Increased wire bonding quality for power modules due to excellent flux removal
- 3 to 10 times longer bath life than traditional surfactant-based cleaners
- Gentle formula leaves solder joints and pads shiny and bright
- Extremely low VOC levels
